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Samsung Galaxy S9 and S9 Plus to be unveiled at MWC next year in February: Report

Firmware for the S9 and S9 Plus is already in the process of development and the model numbers for the S9 is SM-G960 and the S9 Plus is SM-G965.

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Tech2 News Staff|Oct 09, 2017, 20:55:25 IST
Samsung is due to release its flagship smartphones Galaxy S9 and S9 Plus in February next year at the Mobile World Congress (MWC) according to a report by Express. Samsung had earlier unveiled three of its S-series smartphones at the MWC prior to the Galaxy S8 this year, whose release had been pushed forward to April owing to the battery problems faced by the Galaxy Note 7.[caption id="attachment_3992617" align="alignleft" width="380"]Image Courtesy: GizmoChina

Image Courtesy: GizmoChina[/caption]Also according to another report by SamMobile the firmware for the S9 and S9 Plus is already in the process of development and the model numbers for the S9 is SM-G960 and the S9 Plus is SM-G965. Samsung will no doubt retain the curved Super AMOLED infinity display it first introduced on the Galaxy S8 smartphone. The South Korean giant may also include the dual-camera setup which is currently incorporated in the Galaxy Note 8.Earlier rumours had suggested that the S9 and S9 Plus will be housing the new Snapdragon 845 chipset from Qualcomm alongside 4 or 6 GB of RAM. Also it is believed that Samsung will be launching the Galaxy X smartphone with a foldable OLED screen alongside the S9 smartphones. These are however only rumours and speculations and no concrete information is currently available to substantiate these claims.Samsung is also expected to build its own camera sensor in order to compete with the reigning camera sensor maker — Sony. Samsung is likely to build the camera sensor in November so that it can be used in the upcoming Galaxy S9 next year. The report points out that Sony used a three-layer chip where the first layer captured the pixels, second layer comprised of control logic and the third layer packed memory. Samsung will make a two-layered sensor along with DRAM chip to avoid patent infringement.

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First Published:Oct 09, 2017, 20:30:29 IST
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