Freescale And IBM Announce Technology Development Agreement

Freescale Semiconductor and IBM have announced that Freescale will join the IBM technology alliance for joint semiconductor research and development.

The agreement includes Complementary Metal Oxide Semiconductor (CMOS) and Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor research and design enablement transitioning at the 45-nanometer generation.

Freescale is the first technology development partner in the IBM technology alliance to participate in both low-power and high-performance technology research and development.

This alliance will enable Freescale to further strengthen its manufacturing strategy.

In addition to leveraging owned capacity in internal fabs and its existing relationships with leading foundry manufacturers, Freescale will have access to the combined manufacturing capacity of IBM's Common Platform partners.

"This partnership creates an exciting opportunity to combine the complementary strengths of Freescale and the IBM Alliance," said Sumit Sadana, senior vice president, Strategy and Business Development and acting chief technology officer, Freescale.

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"Freescale's addition to the IBM technology alliance is a significant vote of confidence for IBM's collaborative model and the work we are doing jointly with our technology partners," said Lisa Su, vice president, Semiconductor Research and Development, IBM.